Thermally Conductive Cure-in-Place Potting Compounds, ZS-GF-5299Z-30
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ZS-GF-5299Z-30 RTV Silicone Potting Compounds
Description
The ZS-GF-5299Z-30 is a medium viscosity, two-part, heat curing, high thermally conductive sealant. The higher the temperature, the faster it cures. No byproduct occurs during curing, making this potting compound applicable to substrates including plastics and metals like PC(Poly-carbonate), PP, ABS, PVC and more. Temperature range of -40℃ to 200℃ and fully meets EU RoHS and REACH standards.
Typical applications
Potting, encapsulating and thermal protection of power modules and other electron components
Technical specs
| Performance index | Component A | Component B | ||
| Uncured properties | Appearance | Light red liquid | Offwhite liquid | |
| Viscosity (cps) | 12000～18000 | 12000～18000 | ||
| Mix ratio/A:B by weight | 1∶1 | |||
| Mixing viscosity (cps) | 12000-18000 | |||
| Working time at room temperature (min) | 60-90 | |||
| Cure time at room temperature (h) | 4-6 | |||
| Cured properties | Hardness (Shore A) | 50-60 | ||
| Thermal conductivity[W/m.K] | ≥3.0 | |||
| Dielectric Strength (kV/mm) | ≥13 | |||
| Dielectric constant (1.0MHz) | 2.8-3.3 | |||
| Volume resistivity (Ω·cm) | ≥1.0×1013 | |||
| Specific gravity (g/cm3) | 3.0±0.1 | |||
Note:
- The above uncured properties are measured at room temperature where the product is produced.
- Mechanical and electrical properties are tested after the products are fully cured.
- Zhaoshun cannot assume responsibility for different results obtained under different conditions or caused by product improvement.
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