General-Purpose Thermally Conductive Potting Compounds, ZS-GF-5299Z-25
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ZS-GF-5299Z-25 RTV Silicone Potting Compounds
Description
The ZS-GF-5299Z-25 RTV silicone potting compounds have a medium viscosity, two-part and high thermal conductivity. This heat cure product cures faster with higher temperature. As it produces no byproduct when curing, it is applicable for potting on substrates including PC (Poly-carbonate), PP, ABS, PVC and other plastics and metals. This potting compound can be used at -40℃ to 200℃. Conforms to EU RoHS and REACH standards.
Typical applications
Potting, encapsulating and thermal protection of power modules and other electronic components
Technical specs
| Performance index | Component A | Component B | ||
| Uncured properties | Appearance | Light red liquid | Offwhite liquid | |
| Viscosity (cps) | 5000～7000 | 5000～7000 | ||
| Mix ratio/A:B by weight | 1∶1 | |||
| Mixing viscosity (cps) | 5000-7000 | |||
| Working time at room temperature (min) | 60-90 | |||
| Cure time at room temperature (h) | 4-6 | |||
| Cured properties | Hardness (Shore A) | 50-60 | ||
| Thermal conductivity[W/m.K] | ≥2.5 | |||
| Dielectric Strength (kV/mm) | ≥13 | |||
| Dielectric constant (1.0MHz) | 2.8-3.3 | |||
| Volume resistivity (Ω·cm) | ≥1.0×1013 | |||
| Specific gravity (g/cm3) | 3.0±0.1 | |||
Note:
- The above uncured properties are measured at room temperature where the product is produced.
- Mechanical and electrical properties are tested after the products are fully cured.
- Zhaoshun cannot assume responsibility for different results obtained under different conditions or caused by product improvement.
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