General-Purpose Thermally Conductive Potting Compounds, ZS-GF-5299Z-25 Manufacturer

General-Purpose Thermally Conductive Potting Compounds, ZS-GF-5299Z-25

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ZS-GF-5299Z-25 RTV Silicone Potting Compounds

Description

The ZS-GF-5299Z-25 RTV silicone potting compounds have a medium viscosity, two-part and high thermal conductivity. This heat cure product cures faster with higher temperature. As it produces no byproduct when curing, it is applicable for potting on substrates including PC (Poly-carbonate), PP, ABS, PVC and other plastics and metals. This potting compound can be used at -40℃ to 200℃. Conforms to EU RoHS and REACH standards.

Typical applications

Potting, encapsulating and thermal protection of power modules and other electronic components

Technical specs

Performance index			Component A	Component B
Uncured properties		Appearance	Light red liquid	Offwhite liquid
		Viscosity (cps)	5000～7000	5000～7000
		Mix ratio/A:B by weight	1∶1
		Mixing viscosity (cps)	5000-7000
		Working time at room temperature (min)	60-90
		Cure time at room temperature (h)	4-6
Cured properties	Hardness (Shore A)		50-60
	Thermal conductivity[W/m.K]		≥2.5
	Dielectric Strength (kV/mm)		≥13
	Dielectric constant (1.0MHz)		2.8-3.3
	Volume resistivity (Ω·cm)		≥1.0×1013
	Specific gravity (g/cm3)		3.0±0.1

Note:

The above uncured properties are measured at room temperature where the product is produced.
Mechanical and electrical properties are tested after the products are fully cured.
Zhaoshun cannot assume responsibility for different results obtained under different conditions or caused by product improvement.