YIHUA-8508D Hot Air Rework Station
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- YIHUA-8508D hot air rework station applies the SAMSUNG SCM and PID program to accurately control the working temperature, thereby safeguarding delicate components.
- Designed with manual/automatic functions, the air gun can be set according to the application conditions. In the case of frequent use, it can be manually set to save the repeated heating time.
- The desoldering rework station has a wind ball used to indicate the pump pressure.
- Shell of the whole machine unit is manufactured from ferroalloy. It is resistant to abrasion, damage, and high temperature.
- This hot air rework station applies the handle shell made of unique temperature resistant materials. The handle shell is beautiful, and comfortable to use. It withstands temperature extremes.
- It uses the highly reliable ceramic skeleton heater which can be used for a long time.
- A stainless steel air outlet of the handle has good heat conductivity, and perfectly resists abrasion and oxidation.
- The YIHUA-8508D hot air rework station applies spiral wind design. It uses the high quality air pump to produce spiral, soft and uniform air flow.
| Working Voltage | AC 220V±10% 50Hz |
| Output Power | 550W |
| 300℃ Constant Temperature Power (Rapid PID program control, energy-saving and province electricity) | 200W±10% |
| Working Condition | 0~40℃ relative humidity< 80% |
| Storage Temperature | -20~80℃ relative humidity< 80% |
| Dimensions | 255*188*125mm |
| Weight | 3.6KG |
| Temperature Range | 100℃~450℃ |
| Air Supply Mode | Pump air supply |
| Air Flow | 24L/min (Max.) |
| Temperature Stability | ±5℃ (static state) |
| Display Mode | LED |
| Temperature Correction Mode | PID Digital program calibrate |
| PID Temperature Correction Cycle | 200ms |
| Heating Element | Ceramic skeleton heater |
Standard Configuration
Desoldering Station:1pc
Manual: 1pc
Air Gun Handle:1pc
Nozzle:3 (5mm 8mm 10mm)
IC Extractor:1pc
Handle Frame: 1pc
Application
YIHUA-8508D hot air rework station is developed for desoldering different components, including SOIC, CHIP, QFP, PLCC, BGA, etc. Particularly, it is suitable for small area, high-precision desoldering of SMD components.
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