Automatic Smart Card Milling and Implanting Machine, WT-007SCMEM Manufacturer

Automatic Smart Card Milling and Implanting Machine, WT-007SCMEM

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This automatic smart card machine is suitable for milling of the cavity and implanting of the chip module for standard chip cards. The steps including cavity milling, chip module punching and implanting are all carried out in a completely automatic process in one line.

Specifications

Power supply	AC380V/50HZ	Servo accuracy	X, Y=0. 0125mm
Power	7.0KW	Mechanical accuracy	0.01mm
Air source	6 kg/cm²	Control	PLC program ＆ servo system
Air consumption	150L/min	Applicable card materials	Various types of chips, ISO standard card substrate
Weight	1500kg	Operators needed	1
Dimension	2800x850x1750(mm)	Productivity	5500~8500PCS/H
Pass rate	99.8%	Productivity	5500~8500PCS/H

Productivity: 5500~8500PCS/H
Applicable card materials: Various types of chips, ISO standard card substrate
Mechanical accuracy: 0.01mm
Pass rate: 99.8%
Servo accuracy: X, Y=0. 0125mm
Control: PLC program ＆ servo system
Operators needed: 1
Power supply: AC380V/50HZ
Power: 7.0KW
Air source: 6 kg/cm²
Air consumption: 150L/min
Weight: 1500kg
Dimension: 2800x850x1750 (mm)

Features

Integrating cavity milling, dust removal, cavity depth measurement, spot welding, module punching, implanting, bonding and testing in one machine;
Achieving accurate milling depth, regardless of card thickness and size;
Preset standard milling program consists of 4 modules, parameters are programmable according to actual operation needs;
Two milling stations (X, Y and Z axes) can work independently or simultaneously to meet specific milling needs;
Z axis is driven by high precision servo motor and moves along the guide rail to ensure accurate milling depth;
Cavity detection function ensures that chip module will not be implanted when there is no cavity;
Photoelectric sensor automatically identifies chip modules;
Special design of adhesive dispensing ensures precision dosing of adhesive on the milled cavity;
ATR chip module testing system guarantees the pass rate of chip implanting;
Unqualified chip modules are automatically rejected and collected;