Vacuum Pick-Up Soldering Station Suitable for Small PCB Repair, Item WEP-850A(II)

Vacuum Pick-Up Soldering Station Suitable for Small PCB Repair, Item WEP-850A(II)
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Features
  • High power vacuum pump with strong suction ability.
  • Simple operation and designed with highly functional and practical appearance.
  • This equipment is normally used to vacuum pick-up products with smooth and flat surfaces like integrated circuit boards, lenses, etc., and the suction head can be replaced according to the needs of the individual workpiece.
Technical Parameters
Machine Parameter
Power 18W
Voltage 200V~240V50Hz~60Hz
Vacuum Pump Pressure 0.028MPa
Suction Nozzle Dimension φ12mm/φ9mm/φ6mm/φ3mm
Dimension(L*W*H) 179x 132x122mm(±3mm)
net weight About 1.9kg
Working Environment 0~40℃
Storage Environment 20~80℃
Storage Humidity 30%~45%

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