HY-9055 Electronic Potting Silicone
With flame resistance, the two-component electronic potting silicone is a kind of new heat conduction and insulation materials. Offering no heat production, no corrosion and small shrinkage in the curing process, the silicone is applied to sealing and potting electric elements, in addition to encapsulation of LED and LCD screens and circuit boards. The electronic potting silicone, fast cured at high speed, is easy to use. With good elasticity within a wide temperature range, good insulation and heat conduction performance, the silicone has resistance to water, moisture, mildew, dust, chemical mediator, yellowing, weather and ageing.
The electronic potting silicone is typically applied to electronic elements with requirements for water prevention, insulation and heat conduction, such as LED junction boxes, substrates, etc. Also, it is used for bonding and sealing various power modules, control modules, car HID ballasts, car lighting, and power supply control modules.
Technical Data of the HY-9055 Electronic Potting Silicone| Model | HY-9055 | |
| Type | General type | |
| Component | A | B |
| Appearance | Grey liquid | White liquid |
| Mixing ratio | 1 | 1 |
| Viscosity (Pa.s) | 2.5±0.5 | 2.5±0.5 |
| Operating time (min) | 60~90 | |
| Curing time (min) | 25℃ / 180 or 80℃ / 20 | |
| Hardness (A°) | 55±5 | |
| Volume resistivity (Ω) | ≥1×1015 | |
| Dielectric strength (kv/m-1) | ≥25 | |
| Dielectric constant (1.2MHz) | 3.0~3.3 | |
| Temperature resistance (℃) | -60-200 | |
Note: The above data, which is based on the conditions of 25℃ temperature and 55% relative humidity, are offered for reference only.
Use Instructions of the Electronic Potting Silicone
1. Put component A and component B in separate containers and stir evenly before mixing the two components together.
2. The two components are mixed in the weight ratio of 1:1.
3. Leave the uniform mixture for deaeration for three minutes under 0.08MPa.
4. The curing of the electronic potting silicone can be considerably affected by temperature. Under too low temperatures in winter, customers are recommended to heat the mixture appropriately to expedite vulcanization.
5. Substances such as incompletely cured condensation silicone, amine-cured epoxy resin and solder flux may hinder the curing process or cause the silicone not to be cured. Thus users had better check it before use and clean the surface before applying the silicone if necessary.
Packaging, Storage and Transportation
1. The electronic potting silicone is packed 20Kg/set (A: 10Kg, B: 10Kg) in plastic drum.
2. The product has a shelf life of one year (below 25℃).
3. The goods is NOT subject to the provisions of IMDG code. It is treated as general chemicals for safe transportation.
4. The product can still be used after expiration, if it is rechecked and found suitable for use.
Tips
1. The silicone gel should be kept sealed. Use up the well-mixed silicone at one time to avoid waste.
2. Keep the electronic potting silicone away from the mouth and eyes. In case the silicone gets into the mouth or eyes, rinse immediately with plenty of clean water.
3. The product may become layered after being stored for a period of time. Stir it evenly before use, so the silicone performance will not be affected.
4. In order to prevent non-curing, the electronic potting silicone should not touch the following substances: organotin compounds and silicone rubber containing organotin; sulfur, sulphide, and sulfur-containing rubber; aminated compounds and amine-containing materials.
