Tungsten Sputtering Target
Our tungsten sputtering targets have a high purity, and the film formed using our sputtering targets has a high electrical conductivity, which reduces the generation of particles to the greatest degree during the manufacturing process. This purity is up to 99.95%, and provides customers with a high sputtering rate in order to increase productivity.
We have both single and multi-chip planar targets for customers to choose from, and we can customized them in various specifications according to customer demands. Our planar targets feature a high purity, a high density and a uniform structure.
Material: W1
Purity: 99.95% Min.
Density: 19.25g/cm3
Grain size: 100μm Max.
Range: Thickness 3-30mm, Width Max. 500mm, Length Max. 1500mm
Usage: FPD, microelectronic industry
Sifon's rotatable targets effectively improve the service life and efficiency of targets.
Material: W1
Purity: 99.95% Min.
Density: 18.50g/cm3
Grain size: 100μm Max.
Range: Diameter 100-300mm, Length <1500mm
Usage: FPD, microelectronic industry
