Resin Bond Diamond/CBN Grinding Wheel for Polycrystalline silicon
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This product has been discontinued and removed from our shelves.
The resin bond diamond/CBN grinding wheel has a high quality and is used for grinding monocrystalline and polycrystalline silicon. It is suitable for Sigma grinding machines.
Features
- Excellent heat resistance.
- Excellent sharpness.
- High grinding efficiency.
- Good finish.
6A2S Grinding wheel
| Outer diameter (mm) | Overall thickness (mm) | Arbor hole diameter (mm) | Abrasive width (mm) | Abrasive thickness (mm) |
| 75 | 25 | 19.05/20 | 1.5/3 | 6/10 |
| 100 | 25/30 | |||
| 125 | 31.75/32 | |||
| 150 | 30/35 | |||
| 175 | ||||
| 200 | 35/40/50 | 31.75/32/75 | ||
| 250 | ||||
| Note: other specifications can be customized upon request! | ||||
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