Resin Bond Diamond/CBN Grinding Wheel for Polycrystalline silicon

Resin Bond Diamond/CBN Grinding Wheel for Polycrystalline silicon
Resin Bond Diamond/CBN Grinding Wheel for Polycrystalline silicon
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This product has been discontinued and removed from our shelves.

The resin bond diamond/CBN grinding wheel has a high quality and is used for grinding monocrystalline and polycrystalline silicon. It is suitable for Sigma grinding machines.

Features
  • Excellent heat resistance.
  • Excellent sharpness.
  • High grinding efficiency.
  • Good finish.
6A2S Grinding wheel
Outer diameter (mm) Overall thickness (mm) Arbor hole diameter (mm) Abrasive width (mm) Abrasive thickness (mm)
75 25 19.05/20 1.5/3 6/10
100 25/30
125 31.75/32
150 30/35
175
200 35/40/50 31.75/32/75
250
Note: other specifications can be customized upon request!
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